INDUSCON is a biannual event that covers themes related to Industry Applications: Industry 4.0, Robotics and Mechatronics, Automation and Process Control, Power Systems, Electrical Machines and Drives, Power Electronics, Industrial Lighting, Power Quality, Smart Grids, Electrical Vehicle and Energy Storage, Renewable Energy, Safety and Reliability and others. This edition had to be postponed for one year, until August 2021, due to the Covid-19 pandemic. Also due to the pandemic, this edition will be 100% virtual for the first time. These new challenges are opportunities for our academic and industry innovators to create new solutions to the problems of this new era. In this way, the theme of this edition will be “Innovation in the time of Covid-19”.
INDUSCON is IEEE/IAS International Conference on Industry Applications. The conference is sponsored by the Institute of Electrical and Electronics Engineers (IEEE), by the Brazil South Section of IEEE and by the South Section Chapter of the Industry Applications Society (IAS). Since the first edition of the INDUSCON in 1992 the conference is well known as an important forum where the academic community and the industry meet to exchange and discuss scientific research and technological advances.
The 14th INDUSCON 2021 will be organized by Escola Politécnica da Universidade de São Paulo. The conference also has the participation of internationally renowned speakers from both the academy and industry. As a result, INDUSCON is considered one of the most important and renowned conferences in industry applications in Brazil.
The conference provides different tutorials, lectures and technical sections where the speakers can present and discuss their research results and innovations with their academic, scientific and industrial fellows. Keeping the tradition of the event, the papers submitted and approved in English will be sent for publication in the IEEE Xplore platform for international publicity. In this edition, papers submitted in Portuguese and in Spanish will be also sent for publication in the IEEE Xplore.